Com Express CPU Module with 3rd Generation Intel® Core™


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• 3rd Generation Intel® Core™i7
• Faster, Smarter, More Efficient Performance
• Direct mounted Memory with ECC
• Powerful Graphics with three DDI ports
• High Speed Interface
• Wind River Linux and Windows


The CPU-162-17 packs the unparalleled performance and power efficiency of the latest Intel® Core™ i7 processors with the features of the Mobile Intel® QM77 Express chipset in a 125x95mm COM Express basic form factor.

The CPU-162-17 has been designed to deliver superior performance and reliability, in particular for all those applications where uptime and availability are a must.

Standard configurations support the Intel® Core™ i7-3615QE (2.3GHz, Quad Core) and i7-3517UE (1.7GHz, Dual Core) processors. The Intel® Core™ i7-3612QE (2.1GHz, Quad Core) and i7-3555LE (2.5GHz, Dual Core) configurations are build-to-order option.

With support for up to 8GB soldered DDR3L-1600 ECC memory configurations, the CPU-162-17 is ideal to design systems that have to be very resilient to harsh operating conditions.

The pinout of the CPU-162-17 can be switched from Type 6 to Type 2, allowing users to employ a single platform across a number of applications with the maximum efficiency.

The CPU-162-17 supports most major operating systems, including Windows® 7, Windows® Embedded Standard 7 and Wind River Linux.


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Technical Specifications

3rd Generation Intel®Core™ Processor family

• SV: Intel® Core™ i7-3615QE(Quad Core / 2.3GHz / 45W)

• ULV: Intel® Core™ i7-3517UE(Dual Core / 1.7GHz /17W)

• SV: Intel® Core™ i7-3612QE(Quad Core / 2.1GHz /35W) (Build-to-order)

• LV: Intel® Core™ i7-3555LE(Dual Core / 2.5GHz /25W) (Build-to-order)

• Cache Memory: SV=6MB, LV=4MB, ULV=4MB

• Intel®Technologies: Intel® Turbo Boost Technology, Intel® Hyper Threading Technology, Intel® Virtualization Technology, Intel® 64

• Chipset: Mobile Intel®QM77


• SV: Direct-mounted DDR3L-1600 8GB, ECC supported

• ULV: Direct-mounted DDR3L-1600 2GB, ECC supported
(Note) 8GB memory version is only supported by 64-bit OS

• Build-to-order configuration option: SV & LV: Direct-mounted DDR3L-1600, ECC supported (2GB, 4GB or 8GB)

• Boot ROM: SPI-Flash 8MB

COM Express

• PICMG COM.0 COM Express Module Base Specification Rev 2.0

• Basic Module size (125mm x 95mm)

• Type 6 & Type 2 Pinout (without PCIbus, IDE port)

System I/O

• PCI Express Graphics (Gen3): one x16 or two x8 (configurable)

• PCI Express (Gen2): one x4 or two x2(configurable) + two x1

• 3x Graphic DDI (DisplayPort / HDMI / DVI)

• 1x Graphic VGA

• 2x SATA-300 + 2x SATA-600

• 2x USB 2.0 + 2x USB 3.0

• 1x Ethernet 10/100/1000Base-T

• 1x LPC

• 4x GPI + 4x GPO

• 1x SMBus

• 1x I2C Bus

DC 12V (VCC_12V) 12.0V, ±5%

DC 5V (VCC_5VSBY) 5.0V, ±5%

DC 3V (VCC_RTC) 2.0V - 3.0V

• 125mm (W) x 95mm (L) x 21mm (H)(incl.8mm height for heat spreader and spacers)

• Weight: TBD


• Operating Temperature: 0ºC to +60ºC

• Cooling mechanism such as heatsink is required on the heat spreader for heat dissipation during operation.

• Storage Temperature: -10ºC to +70ºC

• Humidity: up to 85%RH (no condensation)

• RoHS compliant

Software OS: Windows® 7, Windows® Embedded Standard 7, Wind River Linux
BIOS Phoenix


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